An Asia Pacific Perspective
Section CTA
- Overview
- Key Figures
- Inside the Whitepaper
- Leader Quote
Section Title
Overview
The Shift to AI Semiconductor Platforms
AI is changing how semiconductors are designed, manufactured and evaluated. Performance now depends on how compute, memory, connectivity, advanced packaging and software work together. This Omdia whitepaper, in partnership with HCLTech, examines Taiwan’s role in powering AI infrastructure and how that role connects to a more distributed Asia Pacific production network, including Singapore, Malaysia, Vietnam and China.
Section CTA
Key Figures
90%+
TSMC’s share of the world’s leading-edge semiconductor production
50%+
80%+
Inside the whitepaper
- The roles of Singapore, Malaysia, Vietnam and China in Asia’s AI semiconductor network and Taiwan’s place within it
- AI demand across industries and the semiconductor technologies behind it
- Advanced packaging’s role in AI performance and capacity planning
- The shift to rack-scale AI systems and its impact on compute, connectivity, power and cooling
- Taiwan’s strengths beyond leading-edge chips
- Five priorities for leaders: differentiation, partnerships, capacity and regional resilience
Section CTA
ceo card background
Leader Quote
AI semiconductor competition is no longer about who builds the fastest chip, but who delivers the best workload outcome. Performance now depends on compute, memory, packaging, connectivity and software being designed together from the start. That makes execution the real differentiator: the leaders will be those who can turn complex silicon ambition into scalable, production-ready platforms."
Ameer SaithuExecutive Vice President & Global Head, Semiconductor Business, HCLTech
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