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Lip-Bu Tan, Intel CEO, onstage with moderator Ed Nelson, Co-Founder and Strategy Director, Kisaco Research, during their fireside chat the AI Infra Summit at the Santa Clara Convention Center. Lip-Bu emphasized that the future of AI will be built through open, heterogeneous systems spanning silicon, software, and ecosystem partnerships.
As enterprise AI transitions to agentic workloads, infrastructure demands are shifting toward specialized, heterogeneous architectures designed around the work rather than a single monolithic chip.
Intel addresses this shift by combining Xeon CPUs, advanced GPU accelerators and open runtime optimizations to lower the latency, power, and overall cost of completed enterprise work.
- Count the Work Done. Not Just the Cores.
- Intel Software Optimizations Boost AI Inference in MLPerf v6.1
- Astera Labs Expands Leo Smart Memory Controller Family for Agentic AI, Inference, and General Purpose Cloud Workloads
- Innodisk Brings Real-Time LLM and VLM Performance to the Edge with Intel Core Ultra Series 3 Processors
- Micron Advances Memory Innovation With the World's First Ultra-Dense Module for Next-Generation Servers
- The AI Opportunity: Silicon to Systems | Intel Business
- Test your VM defenses against memory snooping on Intel® Xeon® 6 and 6+ | Intel Business
- Lower AI inference costs by 66% with intelligent routing on Intel® Xeon® | Intel Business
- Heterogenous Inference: Scale More, Spend Less | Intel Software
- Digital AI to Physical AI: Open Infrastructure to Scale from Models to Machines | Intel Software
