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Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in Ultra-Compact WLCSP and STQFN Packages

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Source: Renesas•September 25, 2026 at 03:55 PM

Renesas Introduces Smallest Configurable GreenPAK IC with Multi-Time Programmability in Ultra-Compact WLCSP and STQFN Packages

TOKYO, Japan, September 24, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155mm × 1.155mm and combines an ultra-small footprint with multi-time programmability, enabling designers to reduce board space in compact products such as smart rings, smartwatches, fitness bands, VR glasses, and portable electronics.

  • The industry's smallest WLCSP-packaged GreenPAK™ device, featuring a 9-ball, 1.155mm × 1.155mm, with an STQFN option for additional I/O and package flexibility.
  • Multi-time programmable and target I²C enable in-system bug fixes, updates, and configuration changes after deployment
  • Full 1.71V to 5.5V operating and configurable range supports versatile, low-cost sensing, control, and glue-logic functions

TOKYO, Japan, September 24, 2026 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the SLG46801, the industry’s smallest GreenPAK configurable mixed-signal device offered in both WLCSP and STQFN packages. The 9-ball WLCSP measures just 1.155mm × 1.155mm and combines an ultra-small footprint with multi-time programmability, enabling designers to reduce board space in compact products such as smart rings, smartwatches, fitness bands, VR glasses, and portable electronics.

As consumer devices become smaller and feature-rich, designers need to integrate additional functionality while reducing component count, PCB area, and bill-of-materials cost. The SLG46801 addresses these requirements by combining commonly used analog, timing, and logic functions in a compact, low-power device that can complement an MCU or replace multiple discrete components.

"Designers are being asked to integrate more functionality into increasingly compact products without increasing system cost or development effort, while also reducing power consumption," said Jason Kim, Vice President and General Manager of the Core Analog Division at Renesas. "The SLG46801 expands our GreenPAK portfolio with an ultra-compact WLCSP option and flexible in-system configurability, helping customers create smaller, more feature-rich products and implement updates even after deployment."

The SLG46801 integrates two high-speed analog comparators, configurable lookup tables, counters and delays, 10kHz and 25MHz oscillators, voltage-tolerant GPIOs, and an I²C-compatible serial interface. These resources support sensing, control, glue-logic, timing, and system housekeeping functions in applications across consumer electronics, handheld devices, smart-home systems, networking and communications, computing and storage, industrial control, and IoT sensor nodes.

In addition to the 9-ball WLCSP, the SLG46801 is available in a 12-lead, 1.6mm × 1.6mm × 0.55mm STQFN package. The two package options allow customers to balance minimum board area with additional GPIO availability and industrial package preferences. The device also offers one of the lowest costs per GPIO in the GreenPAK family.

Renesas is a leader in configurable mixed-signal technology, with more than four billion GreenPAK devices shipped worldwide. GreenPAK ICs enable designers to combine analog and digital system functions in small, low-power devices that can be configured using the Renesas Go Configure™ Software Hub. The free GUI-based development environment helps customers develop custom hardware functions without the need for additional discrete components or complex firmware development.

The SLG46801 includes multi-time programmable non-volatile memory that can be configured in system through its I²C interface. This allows customers to implement bug fixes, configuration changes, and product upgrades after the device has been integrated into the end application, helping reduce redesign cycles and additional hardware revisions.

The device supports operation and programming across the full 1.71V to 5.5V supply range—the widest operating and configurable range among MTP GreenPAK devices. GPIO pins can also be repurposed dynamically for the I²C interface, maximizing flexibility in designs with limited pin availability. Optional CRC-8 and read-back protection support more robust and controlled configurable implementations.

Availability

The SLG46801 in the STQFN package is sampling now, with the WLCSP package available at mass production planned for November 2026. Renesas Go Configure Software Hub is available for programming, emulation, and simulation. More information is available at https://www.renesas.com/products/slg46801.

About Renesas Electronics Corporation

(Remarks) All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.

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