The LS-9000 Series optical micrometer measures the outer diameter of wires such as bare wires, stranded wires, optical fibers, and magnet wires without contact over their total length while running, at a sampling rate of 16,000 times/second. It is highly resistant to vibration and also supports ultra-fine wire and wire breakage detection.
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Inquiries regarding wire outer diameter measurement
Three Issues That Occur When the Outer Diameter of Running Wire Cannot Be Measured Correctly
Variations in the outer diameter of running wire directly affect characteristics and yield rate. Conventional methods each have their own limitations on-site.
Outer Diameter Variations Directly Affect Characteristics and Yield Rate
If the finished outer diameter of wire drawing, stranding, or winding varies, it affects conductor resistance, insulation, and winding characteristics, causing out-of-specification products or wire breakages. If not detected during the process, it manifests as defects in subsequent processes or final products, leading to raw material loss and complaints. Managing the outer diameter over the total length and for all parts is the key to quality. Especially in high-speed wire drawing and stranding lines, even slight variations in outer diameter can result in a large number of defects passing through, significantly impacting the yield rate and cost.
Laser Scan Methods Suffer From Vibration Errors
Running wire always experiences vibration and deflection, but the scanning system has a structure where changes in light-shielding timing easily translate directly into errors. This requires jigs to suppress vibration or speed limits, making 100% inspection on high-speed lines difficult. As a result, measurement reliability decreases, leading to missed defects. If variations caused by vibration are falsely judged as defects, even good products are rejected, and if missed, potential wire breakages escape to subsequent processes, compromising yield rate and reliability.
Contact-Type and Sampling Inspections Cannot Achieve 100% Inspection
Contact methods such as micrometers require stopping the run, and can cause scratches or deformation on small-diameter or soft wires. Sampling-based inspections easily miss wire breakages or localized thinning, leading to escaped defects. A method is needed that can measure all parts non-contactly without stopping the run. If wire breakages or localized thinning escape to subsequent processes or final products, they manifest as winding defects or electrical continuity failures, causing rework and complaints.
Wire Processes and Measurement Points for Outer Diameter and Wire Breakage
Understand the outer diameter and presence of wire in each process from wire drawing to winding, and detect variations and wire breakages early.
- 1 Wire drawing/core fiber – Measurement ①. Measure the outer diameter of bare wires and core fibers non-contactly to manage diameter changes due to die wear. Monitor over the total length without stopping the run.
- 2 Stranded wire/winding – Measurement ②. Continuously measure the outer diameter of running wire at a sampling rate of 16,000 times/second. Stable measurement is achieved even with vibration or tilt, thanks to the high-speed exposure CMOS and tilt correction function.
- 3 Multiple wires/traverse – Measurement ③. Measure the outer diameter of multiple wires simultaneously using a separate transmitter/receiver head, or by tracking the traverse position during winding.
- 4 Wire breakage/presence monitoring/recording – Measurement ④. Monitor the outer diameter and presence of wire to detect wire breakages, missing parts, or localized thinning. Record the outer diameter over the total length to use for quality control.
Comparison of Outer Diameter Measurement Methods for Wires
Depending on the measurement method, there are significant differences in vibration resistance during running, high-speed total length measurement, compatibility with ultra-fine wires, and wire breakage monitoring.
Non-contact / Influence on wire
LS-9000 Series (transmitted light, high-speed exposure CMOS/non-contact)
○ Non-contact, no scratches
Laser scan method
○ Non-contact
Contact micrometer
× Risk of scratches and deformation
Resistance to vibration and tilt during travel
LS-9000 Series (transmitted light, high-speed exposure CMOS/non-contact)
○ High-speed exposure CMOS + tilt correction function
Laser scan method
× Subject to light-shielding timing errors
Contact micrometer
× Difficult to measure during travel
High-speed continuous, full-length/100% inline measurement
LS-9000 Series (transmitted light, high-speed exposure CMOS/non-contact)
○ Full length/100% inspection at 16,000 times/second
Laser scan method
△ Dependent on scanning speed
Contact micrometer
× Requires stopping/sampling
Ultra-fine wire/simultaneous measurement of multiple wires
LS-9000 Series (transmitted light, high-speed exposure CMOS/non-contact)
○ Supports φ10 µm ultra-fine wire and simultaneous traverse measurement
Laser scan method
△ Depends on target and configuration
Contact micrometer
× One point at a time
Monitoring of wire breakage and presence
LS-9000 Series (transmitted light, high-speed exposure CMOS/non-contact)
○ Detection by outer diameter and presence
Laser scan method
△ Depends on configuration
Contact micrometer
× Continuous monitoring not possible
Why Choose the LS-9000 Series
The LS-9000 Series performs non-contact measurement of the outer diameter of running wire using transmitted light edge detection. Its high-speed exposure CMOS and tilt correction function suppress vibration errors inherent in scanning methods, enabling 100% measurement with sampling at 16,000 times/second. It supports φ10 µm ultra-fine wire and simultaneous measurement of multiple wires, and also detects wire breakages through outer diameter and presence monitoring. This eliminates concerns about stopping and scratching associated with contact-type systems.
LS-9000 Series Supports Outer Diameter Measurement of Wires
An optical micrometer using transmitted light from a high-brightness green LED and 3-CMOS. It measures the outer diameter of running wire over its entire length without contact.
Supports Outer Diameter Measurement of Wires — LS-9000 Series
High-speed optical micrometer
Using transmitted light from a high-brightness green LED and 3-CMOS, the outer diameter of running wire is detected via non-contact edge detection. With high-speed sampling of 16,000 times/second, a high-speed exposure CMOS, and tilt correction function, running wire with vibration or tilt can be measured stably. The drive-free structure without a scanning unit ensures long life and maintenance-free operation. The ultra-fine mode enables stable measurement of ultra-fine wires down to φ10 µm and gaps, and the separate transmitter/receiver type supports simultaneous traverse measurement of multiple wires. With an air purge function and IP67 environmental-resistance design, it can be installed in wire drawing, stranding, and winding lines in dust and oil mist environments, and can also be used to detect wire breakage and missing wires through outer diameter and presence monitoring.
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Get Detailed Materials for the LS-9000 Series
You can download a free catalog summarizing Specifications, system configuration, and application examples.
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Inquiries regarding wire outer diameter measurement
Application Examples of Outer Diameter Measurement of Wires
It is used for outer diameter measurement of various running wires, such as magnet wires, ultra-fine wires, and optical fibers.
Outer Diameter Measurement of Magnet Wires and Ultra-Fine Wires
With high-speed sampling of 16,000 times/second, even high-speed lines of 1000 m/min can be measured at a pitch of approximately 1 mm. Ultra-fine wires of φ10 µm are measured with a head designed for ultra-fine wires.
Simultaneous Outer Diameter Measurement of Multiple Wires and Traverse Measurement
The separate transmitter/receiver head measures the outer diameter of multiple wires simultaneously or by following the traverse position of winding. This enables 100% inspection in a space-saving design.
Outer Diameter and Pitch Measurement of Saw Wires
Simultaneously measures the outer diameter and pitch of multiple saw wires. It makes it easy to determine when maintenance is needed by capturing changes over time due to cutting processes.
Outer Diameter Measurement in Harsh Environments (Air Purge, IP67)
Stable measurement is possible even in dust and oil mist environments thanks to the air purge function. The IP67 environmental-resistance design allows for long-term installation in wire drawing and stranding lines.
Frequently Asked Questions About Outer Diameter Measurement of Wires (LS-9000 Series)
Yes, it can. The LS-9000 Series measures the outer diameter of running wire without contact using transmitted light edge detection, and continuously measures the entire length with 16,000 times/second sampling.
While the scanning system has a structure where vibration during running easily causes errors in light shielding timing, the LS-9000 Series is resistant to vibration and tilt thanks to the high-speed exposure CMOS and tilt correction function, ensuring stable measurement.
Yes, it can. The ultra-fine mode enables stable measurement of ultra-fine wires down to φ10 µm and gaps, and the separate transmitter/receiver type also supports simultaneous and traverse measurement of multiple wires.
Yes, it can. By monitoring the outer diameter and the presence/absence of wire, it detects wire breakage, missing wire, and local thinning, preventing line stoppages and defective products from being shipped.
Yes, it can. Non-contact measurement allows for full-length measurement without stopping the line or scratching thin or soft wires, eliminating missed defects from sampling inspections.
Yes, it can. With the air purge function and IP67 environmental resistance design, it measures stably even in harsh environments of wire drawing, stranding, and winding lines.
Measurement methods, installation configurations, and specifications can be confirmed in the catalog or via the inquiry form.
- High-speed optical micrometer LS-9000 series
High-speed optical micrometer
LS-9000 series
