It is critical for customers deploying data center infrastructure, particularly for AI workloads, to be able to trust the silicon they are running on. A key challenge is knowing whether manufacturing records are authentic and belong to the processor they are evaluating. AMD Device Provenance aims to give customers a way to make those checks independently, whether they operate their own infrastructure or use cloud services.

Last year at the OCP Global Summit, AMD demonstrated an early device provenance proof of concept focused on manufacturing and lifecycle evidence for data center components. This year's prototype goes further, showing how device provenance, artifact signing, standards-based transparency (IETF RFC 9943, RFC 9942, and RFC 9995), and independent validation can operate together as an end-to-end flow. This work represents the initial stage of a broader industry effort. The OCP demonstration illustrates a proof-of-concept integration of these technologies for hardware provenance and supply chain assurance and should not be interpreted as a product commitment.

AMD and Microsoft are partnering to raise the assurance bar for the semiconductor supply chain and explore how stronger manufacturing evidence, secure evidence handling, and standards-based verification can improve traceability across the device lifecycle.

Journey to Verifiable Provenance

This proof-of-concept explores how manufacturing evidence can evolve from a silicon vendor-issued record into evidence a relying party can independently verify and evaluate. Drawing on proven software supply chain concepts, AMD and Microsoft have prototyped a single assurance flow that brings together hardware provenance, signing, transparency, and validation. The flow moves through four stages:

Device-Bound Provenance: AMD builds a Hardware Bill of Materials (HBOM) across key manufacturing stages and cryptographically binds it to the finished System on a Chip (SoC), helping create device-specific provenance evidence.
Provenance Signing: AMD uses Microsoft’s Artifact Signing to sign a provenance statement containing the HBOM and its original factory signing evidence, helping protect their integrity and binding them to AMD’s signing identity.
Signing Transparency: The signed provenance statement () is registered with a dedicated instance of Microsoft’s Signing Transparency, which applies the IETF Supply Chain Integrity, Transparency, and Trust (SCITT) architecture () to help create a durable, tamper-evident record.
Relying-Party Validation: A validator checks the signature, artifact binding, ledger receipt (), and issuer against defined trust policies, illustrating how provenance evidence can be independently evaluated.

Together, these capabilities allow a cloud customer presented with this evidence to gain confidence that their workloads are running on the expected AMD hardware.

To learn more and help shape the future of the Artifact Signing and Signing Transparency services, join the Artifact Signing with Signing Transparency preview community.

A Closer Look at the Prototype

At the 2026 OCP Global Summit, AMD and Microsoft will demonstrate this proof of concept on the flagship 6th Generation AMD EPYC™ processor, which is a fitting platform to explore how next-generation compute can be paired with stronger, independently verifiable supply chain evidence.

The demonstration follows a simple prototype flow:

Create and bind provenance evidence. AMD generates an HBOM from provenance collected across key manufacturing stages and cryptographically associates it with the AMD EPYC™ processor.
Protect and record the evidence. AMD transparently signs the provenance package, using Artifact Signing, and the resulting signed statement is registered with Microsoft's Signing Transparency to help create a durable, tamper-evident record.
Independently validate the result. A validator can verify the signed evidence, transparency receipt, and device association, illustrating how a relying party may evaluate the provenance and reach a trust decision.

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Together, these steps show how evidence can move from semiconductor manufacturing through signing, transparency, and independent validation helping increase customer trust in the silicon running their workloads.

Visit the AMD (#C61) booth at the 2026 OCP Global Summit to see the proof of concept demonstrated on AMD EPYC™ and explore how device provenance, signing transparency, and independent validation come together as early building blocks for verifiable, evidence-based semiconductor supply chain assurance.